Light connects two worlds on a single chip

18.01. 2019 Semiconductor Technology News - Semiconductor News, Semiconductors, Semiconductor Technology

For the first time, researchers of the University of Twente succeeded in connecting two parts of an electronics chip using an on-chip optical link. A light connection could be a safe way of connecting a high-power component and digital control circuitry on one chip without a direct electrical link. Until now, however, an optical link was not possible using standard silicon chip technology. Vishal Agarwal, a UT Ph.D. student, managed to do so. He realized a very small optocoupler circuit that delivers a data rate of Megabits per second in an energy-efficient way.

II-VI introduces 405nm laser for biomedical instruments

18.01. 2019 Semiconductor Today News

Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA has extended its compact, low-noise QOMO laser series for analytical instruments in life sciences, including for flow cytometers, confocal microscopes and biomedical imaging applications...

Instrument Systems showcasing fast, high-resolution spectroradiometers for laser and VCSEL characterization

17.01. 2019 Semiconductor Today News

In the German pavilion at Photonics West 2019 in San Francisco (5-7 February), Instrument Systems GmbH of Munich, Germany (a subsidiary of Konica MinoIta Group since 2012) is showcasing its premium-class high-resolution spectroradiometers for the characterization of laser light sources and displays. The reference device CAS 140D forms the basis of the system and is supplemented by the high-resolution CAS 140CT-HR model. Both devices can be viewed in simulated applications in booth 4545-38...

Teledyne e2v HiRel extends space-qualified InGaP gain blocks to X-band

17.01. 2019 Semiconductor Today News

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has announced availability of the new 14GHz family of RF gain blocks, spearheaded by an 18.4dB amplifier (TDGB014-003)...

Transphorm GaN FET used in TDK-Lambda’s latest-generation AC-DC power supply module

16.01. 2019 Semiconductor Today News

Transphorm Inc of Goleta, near Santa Barbara, CA, USA — which designs and manufactures JEDEC- and AEC-Q101-qualified high-voltage (HV) gallium nitride (GaN) field-effect transistors (FETs) for high-voltage (HV) power conversion applications — says that TDK-Lambda Corp (a group company of TDK Corp that makes power supplies for industrial equipment) has released its first GaN-based AC-DC power supply...

Further EPC eGaN FETs now AEC-qualified for automotive power systems

16.01. 2019 Semiconductor Today News

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA – which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications – has announced AEC Q101 qualification of two additional eGaN devices, addressing a range of applications in the automotive industry and other harsh environments. The new products EPC2206 and EPC2212 are both discrete transistors in wafer-level chip-scale packaging (WLCS) with 80VDS and 100VDS ratings, respectively...

ULVAC and OIPT collaborating to bring atomic-scale processing to Japanese power and RF markets

16.01. 2019 Semiconductor Today News

UK-based plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) and ULVAC Inc of Chigasaki, Kanagawa, Japan have announced a collaboration to bring leading-edge deposition and etch technology solutions to gallium nitride (GaN)- and silicon carbide (SiC)-based wide-bandgap production customers in Japan...

San’an expands ROY LED production with Aixtron AIX 2800G4-TM MOCVD systems

16.01. 2019 Semiconductor Today News

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany is to supply multiple AIX 2800G4-TM (IC2) cluster systems to Xiamen-based San’an Optoelectronics Co Ltd (China’s largest producer of full-color ultra-high-brightness LED epiwafers and chips), supporting its long-term plan to address the rising market demand for fine-pitch displays, which requires a capacity increase in arsenide-phosphide-based red, orange and yellow LEDs (ROY LEDs). All AIX 2800G4-TM (IC2) tools will feature a 15x4”-wafer configuration and are scheduled for shipment between fourth-quarter 2018 and second-quarter 2019...

Anokiwave’s founder & CTO named IEEE Fellow

16.01. 2019 Semiconductor Today News

Anokiwave Inc of San Diego, CA, USA – which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) markets and active antenna-based solutions – says that founder & chief technology officer Dr Nitin Jain has been named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for leadership in the development of physics-based models for mmWave system-on-chip ICs...

NeoPhotonics raises Q4/2018 profit guidance

15.01. 2019 Semiconductor Today News

For fourth-quarter 2018, NeoPhotonics Corp of San Jose, CA, USA (a vertically integrated designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for high-speed communications networks) has announced preliminary results that reflect recent developments including the end-of-life of certain client transceiver modules, a legal settlement, and the signing of a definitive agreement to sell its manufacturing operations in Russia...

AXT cuts Q4/2018 revenue guidance from $26.5-27.5m to $22-22.4m after caution-induced order slowdown

14.01. 2019 Semiconductor Today News

For its fourth-quarter 2018 results (to be announced on 20 February), AXT Inc of Fremont, CA, USA – which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials in Beijing, China – has reduced its revenue expectation from previous guidance of $26.5-27.5m (provided on 31 October) to $22-22.4m (down from $26.3m in Q4/2017)...

SemiLEDs’ quarterly revenue falls by half

11.01. 2019 Semiconductor Today News

For its fiscal first-quarter 2019 (to end-November 2018), LED chip and component maker SemiLEDs Corp of Hsinchu, Taiwan has reported revenue of $972,000, roughly halving from $1.95m last quarter and $2m a year ago...

Sanan’s mini-LED and micro-LED chips on display at CES

10.01. 2019 Semiconductor Today News

Xiamen-based San’an Optoelectronics Co Ltd (China’s largest producer of full-color ultra-high-brightness LED epiwafers and chips) says that at the 2019 Consumer Electronics Show (CES) in Las Vegas (8-11 January) several panel makers for TVs, digital displays, smartphones, smart watches, augmented/virtual reality (AR/VR) goggles, and gaming notebooks have unveiled new products using its latest mini-LED and micro-LED chips...

UVphotonics and FBH unveiling 280–320nm UVB and 230–280nm UVC LEDs at Photonics West

10.01. 2019 Semiconductor Today News

Together with Berlin-based Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in the German Pavilion (booth 4545-50) at Photonics West 2019 in San Francisco, CA, USA (5-7 February), UVphotonics NT GmbH – a spin-off from FBH and Technische Universität Berlin (TU Berlin) that makes LEDs emitting in the UVB (280–320nm) and the UVC (230–280nm) wavelength regions – is showcasing its latest UV LED developments...

Riber reduces 2018 revenue guidance from €35m to €31m after deferral of two system deliveries to Q1/19

10.01. 2019 Semiconductor Today News

Following the deferral of deliveries for two systems to first-quarter 2019, Riber S.A. of Bezons, France – which manufactures molecular beam epitaxy (MBE) systems as well as evaporation sources and effusion cells – is reducing its revenue forecast for full-year 2018 from €35m to €31m (albeit still up on €30.6m for 2017)...