TSMC becomes the largest semiconductor supplier in the world in 2Q13

27.08. 2013 Solid State Technology

Share of total IC market by foundry-produced devices is forecast to reach over 45 percent in 2017.

$5.2B in printed electronics is expected to be sold in 2015

22.08. 2013 Solid State Technology

The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013

Despite challenges, industrial semiconductor market reports positive Q1

15.08. 2013 Solid State Technology

The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared.

Tablet and cellphone processors offset PC MPU weakness

13.08. 2013 Solid State Technology

Total microprocessor sales are forecast to rise 8 percent in 2013 and reach $61.0 billion.

Second quarter shows increase in silicon wafer shipments

07.08. 2013 Solid State Technology

Worldwide silicon wafer area shipments increased during the second quarter 2013 when compared to first quarter 2013 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Crossbar unveils resistive RAM with simple, three-layer structure

05.08. 2013 Pete Singer

Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.

First half of 2013 shows big changes to top 20 semiconductor supplier ranking

05.08. 2013 Solid State Technology

Later this month, IC Insights’ August Update to the 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1H13.

Foreign IC companies to represent 70% of China’s IC production in 2017

24.07. 2013 Solid State Technology

China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.

Hybrid Memory Cube nears engineering sample milestone

18.07. 2013 Pete Singer

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

Solid State Technology and SEMI announce 2013 “Best of West” award winner

11.07. 2013 Solid State Technology

Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.

SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

10.07. 2013 Solid State Technology

When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.

Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017

02.07. 2013 Solid State Technology

Capacity for 200mm wafers forecast to slip more than 10 points during same period.

May PC shipments reflect slow second quarter

28.06. 2013 Solid State Technology

The PC market continued to suffer slow shipment growth in top countries across regions in May.

Post-PC shift: Mobile devices to consume more DRAM than PCs in 2015

25.06. 2013 Solid State Technology

In a telling sign of the arrival of the post-PC era, mobile platforms for cellphones as well as media- and PC-type tablets are on the verge of overtaking traditional desktops, notebooks and servers as the biggest consumer of DRAM.

Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

20.06. 2013 Solid State Technology

Outlook for semiconductor equipment market improves, but remains soft in the short term.