Primoceler develops world’s first sapphire-to-sapphire welding machine

13.08. 2013 Solid State Technology

New technology allows process even more difficult than glass-to-glass welding, expanding the ways in which industries can take advantage of the versatile and popular sapphire.

Compact linear piezo nanopositioning stage

07.08. 2013 Solid State Technology

PI (Physik Instrumente) L.P., a manufacturer of nanopositioning equipment — offers the LPS-45 series of piezo positioning stages manufactured by PI subsidiary PI miCos.

PI releases high power piezo amplifier

05.08. 2013 Solid State Technology

PI (Physik Instrumente) presents the E-482, a new high-power amplifier providing 6 kW peak power with an energy saving power recovery design.

Scrubber developed for POU abatement of wet bench gases

18.07. 2013 Solid State Technology

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

ROFIN presents turnkey solutions for FEOL applications

03.07. 2013 Solid State Technology

The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading handling system for (ultra) thin semiconductor wafers and a choice of laser processing modules, depending on the type of application.

EV Group launches new LowTemp room temperature debonding platform

01.07. 2013 Solid State Technology

EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.

All-in-one microscope for advanced imaging, recording and measurement

07.06. 2013 Solid State Technology

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.

Olympus launches LEXT OLS4100 laser confocal microscope

07.06. 2013 Solid State Technology

New 3D measuring system offers auto brightness and high-speed stitching.

Spectra-Physics introduces industrial picosecond laser

10.05. 2013 Solid State Technology

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.

Quartz Imaging introduces automated measurement for semiconductor images

30.04. 2013 Solid State Technology

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

30.04. 2013 Solid State Technology

Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters. 

MoSys announces support of GigaChip interface

23.04. 2013 Solid State Technology

MoSys, a provider of semiconductor solutions, today announced that Macnica Americas, a provider of semiconductor distribution and design services, will support the GigaChip Interface in its distribution and technology innovation business.

Picosun’s 300mm ALD cluster tools selected for new memory applications

10.04. 2013 Solid State Technology

Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications.