Cascade Microtech and imec successfully probe 25µm-diameter micro-bumps

01.08. 2013 Solid State Technology

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

30.07. 2013 Solid State Technology

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

Rudolph announces new metrology suite for advanced packaging

24.07. 2013 Solid State Technology

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

Options for adding memory and logic to printed or flexible electronics

02.07. 2013 Solid State Technology

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

Inside ASET’s Dream Chip

01.07. 2013 Dr. Phil Garrou

The International Symposium on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm.

Siliconware announces entrance into high density 2.5D interposer market

28.06. 2013 Dr. Phil Garrou

At the ConFab conference in Las Vegas this week Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.”

Deca Technologies appoints Chris Seams as CEO

24.06. 2013 Solid State Technology

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.

"Generation Mobile": Advanced Packaging Technology at SEMICON West

06.06. 2013 Solid State Technology

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

Fab equipment spending: 23% growth for 2014

05.06. 2013 Solid State Technology

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

NVIDIA’s GPUs; Patent analysis

03.06. 2013 Solid State Technology

NVIDIA has publically updated their roadmap with the announcement of the GPU family that will follow 2014's Maxwell family. That new family is Volta which will use stacked DRAM, which will be connected to the GPU with TSV.

Mentor Graphics and TSMC collaborate on 20nm IC physical verifications

29.05. 2013 Solid State Technology

Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.

Global semiconductor sales outpace last year through Q1 of 2013

14.05. 2013 Solid State Technology

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics

02.05. 2013 Solid State Technology

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

Amkor Technology appoints Steve Kelley president and CEO

01.05. 2013 Solid State Technology

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.

SEMI reports March book-to-bill ratio of 1.14

19.04. 2013 Solid State Technology

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

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