Cascade Microtech and imec successfully probe 25µm-diameter micro-bumps

01.08. 2013 Solid State Technology

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

30.07. 2013 Solid State Technology

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

Hybrid Memory Cube nears engineering sample milestone

18.07. 2013 Pete Singer

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

Options for adding memory and logic to printed or flexible electronics

02.07. 2013 Solid State Technology

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

Learning the secrets of design for yield

01.07. 2013 Solid State Technology

Random process variations and layout-dependent effects are a fact of life for designers working at the more advanced process nodes and become critical at 45nm. Besides random and systematic variation effects, reliability effects, such as bias-temperature-instability (BTI), also become prevalent, introducing another dimension of variations that impact parametric yield.

Siliconware announces entrance into high density 2.5D interposer market

28.06. 2013 Dr. Phil Garrou

At the ConFab conference in Las Vegas this week Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.”

Fab equipment spending: 23% growth for 2014

05.06. 2013 Solid State Technology

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Statistical variation monitoring for production control

03.06. 2013 Solid State Technology

The sources of parametric variation are reviewed, with an eye on why these issues become worse as the technology is scaled and how this variation can be monitored and controlled. TIMOTHY TURNER, College of Nanoscale Science & Engineering (CNSE), Albany, NY.

News Products

03.06. 2013 Solid State Technology

GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology

31.05. 2013 Solid State Technology

The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.

New power management IC helps reduce thermal stress on processors in phones and tablets

28.05. 2013 Solid State Technology

ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.

North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

22.05. 2013 Solid State Technology

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.

Global semiconductor sales outpace last year through Q1 of 2013

14.05. 2013 Solid State Technology

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics

02.05. 2013 Solid State Technology

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

Amkor Technology appoints Steve Kelley president and CEO

01.05. 2013 Solid State Technology

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.