Scrubber developed for POU abatement of wet bench gases

18.07. 2013 Solid State Technology

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

Fab equipment spending: 23% growth for 2014

05.06. 2013 Solid State Technology

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

GT Advanced Technologies acquires Thermal Technology LLC

16.05. 2013 Solid State Technology

GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.

Meeting the challenge of film frame handling automation

01.05. 2013 Solid State Technology

Semiconductor and LED manufacturers are interested in automating the film frame handling process as a means to increase throughput and yield in their BEOL processes. BOB FUNG and JACK YAO, Owens Design, Fremont, CA

Hitachi launches brand-new GaN-template product

26.04. 2013 Solid State Technology

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

Memory, foundry and LED markets drive fab spending in southeast Asia

11.04. 2013 Solid State Technology

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.