Moore’s Law Dead by 2022: Crying Wolf?

30.08. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

Entegris and imec collaborate on 3D wafer handling and shipping challenges

28.08. 2013 Solid State Technology

Entegris, Inc. and imec announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.

Samsung introduces world’s first 3D V-NAND-based SSD

14.08. 2013 Solid State Technology

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

Monolithic 3D is now in production: Samsung starts mass producing first 3D vertical NAND flash

06.08. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about Samsung's recent announcement on 3D vertical NAND.

Samsung starts mass producing industry’s first 3D vertical NAND flash

06.08. 2013 Solid State Technology

New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.

Monolithic 3D is now on the roadmap for 2019

01.08. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.

Cascade Microtech and imec successfully probe 25µm-diameter micro-bumps

01.08. 2013 Solid State Technology

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

EUV vs TSV: Which one will become production ready first?

31.07. 2013 Solid State Technology

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 

Rudolph announces new metrology suite for advanced packaging

24.07. 2013 Solid State Technology

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

Brewer Science: Simpler bonding/debonding process needed

18.07. 2013 Pete Singer

A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.

Hybrid Memory Cube nears engineering sample milestone

18.07. 2013 Pete Singer

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

SEMICON West R&D panel discusses the future of semiconductor technology

10.07. 2013 Solid State Technology

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.

Dow Corning joins imec for advancement of enabling technologies for 3D-IC

09.07. 2013 Solid State Technology

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway

02.07. 2013 Solid State Technology

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.

Inside ASET’s Dream Chip

01.07. 2013 Dr. Phil Garrou

The International Symposium on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm.