Diving deep — because materials matter

08.08. 2013 Solid State Technology

A note from Karen Sevala, president, SEMI Americas.

ASML at Semicon West 2013: SRAM scaling has stopped!

18.07. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."

Semiconductor roadmapping update: Front-end technologies – Part 2

15.07. 2013 Solid State Technology

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.

Semiconductor roadmapping update: Front-end technologies Part 1

15.07. 2013 Solid State Technology

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.

Continued strength of Taiwan’s semiconductor market on display

11.07. 2013 Solid State Technology

SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing.

Conventor addresses new requirements of 3D fab era

11.07. 2013 Solid State Technology

Coventor, Inc., a supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), shared the SEMulator3D 2013 software platform at SEMICON West 2013.

Growing opportunities in the Asian secondary semiconductor equipment market

11.07. 2013 Solid State Technology

Bruce Kim, CEO of SurplusGLOBAL,  expects a slight upturn in the Asian Secondary Semiconductor  Equipment Market at Semicon West.

cyberTECHNOLOGIES introduces Interferometric accuracy on suite of Surface Metrology Systems

11.07. 2013 Solid State Technology

cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.

Boston Semi Equipment announces expansion of front and back end equipment business

11.07. 2013 Solid State Technology

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

Solid State Technology and SEMI announce 2013 “Best of West” award winner

11.07. 2013 Solid State Technology

Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.

SEMICON West R&D panel discusses the future of semiconductor technology

10.07. 2013 Solid State Technology

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.

SEMI Standards honors industry leaders at SEMICON West 2013

10.07. 2013 Solid State Technology

SEMI honored 14 industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2013.

Leti discusses different lithography options for advanced technology nodes at SEMICON West 2013

10.07. 2013 Solid State Technology

Dr. Tedesco suggested that an “optical forever” solution using 193nm immersion lithography in combination with a pitch-multiplication strategy could well provide lithography solutions to very advanced nodes on the industry’s technology roadmap.

Leti and EV Group launch a common lab on wafer bonding technologies

10.07. 2013 Solid State Technology

Project targets more efficient 3D TSV integration and covalent bonding at room temperature

New methods to reduce time and cost of R&D

10.07. 2013 Solid State Technology

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.