Monolithic 3D is now on the roadmap for 2019

01.08. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.

EUV vs TSV: Which one will become production ready first?

31.07. 2013 Solid State Technology

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 

ASML at Semicon West 2013: SRAM scaling has stopped!

18.07. 2013 Solid State Technology

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."

Scrubber developed for POU abatement of wet bench gases

18.07. 2013 Solid State Technology

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

Hybrid Memory Cube nears engineering sample milestone

18.07. 2013 Pete Singer

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

F450C hosts panel during SEMICON West to address 450mm facility infrastructure

03.07. 2013 Solid State Technology

Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.


02.07. 2013 Solid State Technology

SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”

Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway

02.07. 2013 Solid State Technology

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.

Options for adding memory and logic to printed or flexible electronics

02.07. 2013 Solid State Technology

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

Latest manufacturing innovations in MEMS, LEDs, silicon photonics and more featured at SEMICON West

26.06. 2013 Solid State Technology

Recent advances in microelectronics technology and production processes have led to the rapid acceleration in MEMs and LED manufacturing, and breakthroughs in silicon photonics and printed/flexible electronics.  But what comes next?

Multitest VP to discuss quality in 3D assembly at SEMICON West

18.06. 2013 Solid State Technology

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.

SEMI releases report on first quarter 2013 manufacturing equipment billings

11.06. 2013 Solid State Technology

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.

"Generation Mobile": Advanced Packaging Technology at SEMICON West

06.06. 2013 Solid State Technology

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

450mm – It’s bigger than you think

06.06. 2013 Solid State Technology

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.